Progress in Thermoplastic Adhesives
نویسندگان
چکیده
منابع مشابه
Thermoplastic Adhesives - the Attachment Solution for Multichip Modules
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Direct printing nanoparticle-based conductive inks onto paper substrates has encountered difficulties e.g. the nanoparticles are prone to penetrate into the pores of the paper and become partially segmented, and the necessary low-temperature-sintering process is harmful to the dimension-stability of paper. Here we prototyped the paper-based circuit substrate in combination with printed thermopl...
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ژورنال
عنوان ژورنال: Kobunshi
سال: 1970
ISSN: 0454-1138,2185-9825
DOI: 10.1295/kobunshi.19.523